The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jun. 23, 2022
Intel Corporation, Santa Clara, CA (US);
Cemil S. Geyik, Gilbert, AZ (US);
Zhiguo Qian, Chandler, AZ (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a microelectronic assembly comprise: a package substrate having a first face and an opposing second face, the package substrate comprising a conductive trace in a dielectric material, a conductive structure at least partially surrounding the conductive trace and separated from the conductive trace by the dielectric material; and an integrated circuit (IC) die attached to the first face of the package substrate and coupled to the conductive trace by a conductive pathway through the package substrate. The conductive trace has a non-rectangular cross-section with rounded corners, the conductive structure comprises a plurality of conductive planes parallel to the conductive trace and coupled to a ground connection.