The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Apr. 13, 2022
Intel Corporation, Santa Clara, CA (US);
Mitul Modi, Phoenix, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Amruthavalli P. Alur, Tempe, AZ (US);
Yikang Deng, Chandler, AZ (US);
Eric J. Li, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is provided which comprises: a plurality of dielectric layers forming a substrate, a plurality of first conductive contacts on a first surface of the substrate, a cavity in the first surface of the substrate defining a second surface parallel to the first surface, a plurality of second conductive contacts on the second surface of the substrate, one or more integrated circuit die(s) coupled with the second conductive contacts, and mold material at least partially covering the one or more integrated circuit die(s) and the first conductive contacts. Other embodiments are also disclosed and claimed.