The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Mar. 23, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Georgios C. Dogiamis, Chandler, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Javier A. Falcon, Chandler, AZ (US);
Yoshihiro Tomita, Ibaraki, JP;
Vijay K. Nair, Mesa, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 24/13 (2013.01); H01L 24/20 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19105 (2013.01);
Abstract
Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.