Intel Corporation

Other

Damion T Searls

Terrance J Dishongh

James Daniel Jackson

Bin Lian

Prateek J Dujari

Weston C Roth

Tom E Pearson

Terry Dishongh

Edward Paul Osburn

David H Pullen

Thomas O Morgan

Yoshihiro Tomita

Charles A Gealer

Rainer E Thomas

Margaret D Ramirez

Jun Zhang

David Shia

Richard J Dischler

Barrett M Faneuf

Jin Yang

Eric W Buddrius

Bijoyraj Sahu

Thomas G Ruttan

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Catharina Biber

Dudi I Amir

Kristin L Weldon

Jiteender P Manik

Michael Berktold

Ying-Feng Pang

Yi Xia

Victor Polyanko

Brendan T Pavelek

Carlos Alvizo Flores

Lianchang Du

Javier Avalos Garcia

Yuyang Xia

Minh T D Le

Mark Bianco

Yuehong Fan

Luz Karine Sandoval Granados

David I Amir

Adriana Lopez Iniguez

Roth O Weston

Terrence J Dishongh

Terrance J Dioshongh

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Prateek Dujari

Thomas Ruttan

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

Mainboard assembly including a package overlying a die directly attached to the mainboard

In one embodiment, the present invention includes a semiconductor device mounted to a first side of a circuit board; and at least one voltage regulator device mounted to a second side of the circuit board, the second side opposite to the first side. Examples of the voltage regulator devices include output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Reducing loadline impedance in a system

In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Method for reducing loadline impedance in a system

In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

Apparatus and method for passive phase change thermal management

A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.

Method of fabricating flexible display

A thin semiconductor device package, comprising a thin substrate at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.

Thin semiconductor device package

A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.

Method for improved high current component interconnections

A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.

The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.

Apparatus and method for improving AC coupling on circuit boards

In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

Method for passive phase change thermal management

A method includes providing a light pipe having a metallized end surface, and soldering the metallized end surface of the light pipe to a surface of a substrate. Other embodiments are described and claimed.

Electro-optic surface mount light pipe and connector

A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

Capacitor placement for integrated circuit packages

A display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.

Flexible display

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Portland, OR, United States of America

Damion T Searls