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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9950393 B1

PDFFull Text
Date of Patent:
Apr. 24, 2018

Filed:

Dec. 23, 2011

Hybrid low metal loading flux

Applicants:

Rajen S. Sidhu, Chandler, AZ (US);

Martha A. Dudek, Chandler, AZ (US);

James C. Matayabas, Jr., Chandler, AZ (US);

Michelle S. Phen, Chandler, AZ (US);

Wei Tan, Chandler, AZ (US);

Inventors:

Rajen S. Sidhu, Chandler, AZ (US);

Martha A. Dudek, Chandler, AZ (US);

James C. Matayabas, Jr., Chandler, AZ (US);

Michelle S. Phen, Chandler, AZ (US);

Wei Tan, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorneys:

Konrad Raynes Davda & Victor LLP

Alan S. Raynes

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/362 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/362 (2013.01); H01L 23/488 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H05K 3/3489 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/03828 (2013.01); H01L 2224/03829 (2013.01); H01L 2224/03849 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/058 (2013.01); H01L 2224/05794 (2013.01); H01L 2224/05809 (2013.01); H01L 2224/05811 (2013.01); H01L 2224/05813 (2013.01); H01L 2224/05817 (2013.01); H01L 2224/05839 (2013.01); H01L 2224/05844 (2013.01); H01L 2224/119 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3841 (2013.01); H05K 2203/041 (2013.01); H05K 2203/046 (2013.01);
Abstract

Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

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