The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2017

Filed:

Feb. 19, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Yonghao Xiu, Chandler, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Yiqun Bai, Chandler, AZ (US);

Arjun Krishnan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); C08K 3/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08K 3/0033 (2013.01); H01L 21/563 (2013.01); H01L 23/295 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83102 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0493 (2013.01); H01L 2924/04642 (2013.01); H01L 2924/053 (2013.01); H01L 2924/0533 (2013.01); H01L 2924/05341 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/186 (2013.01);
Abstract

An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.


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