Company Filing History:
Years Active: 2014-2018
Title: Innovations by Inventor Yonghao Xiu
Introduction
Yonghao Xiu is a prominent inventor based in Chandler, AZ (US), known for his significant contributions to microelectronic packaging technologies. With a total of 8 patents to his name, he has made remarkable advancements in the field, particularly in enhancing adhesion in package structures.
Latest Patents
Yonghao Xiu's latest patents include innovative methods for promoting adhesion between underfill and conductive bumps. These methods involve modifying underfill materials with various adhesion promoters and cross-linking chemistries to improve adhesion in microelectronic packaging. Another notable patent focuses on a narrow-gap flip chip underfill composition, which comprises a curable resin and a specific arrangement of filler particles to optimize viscosity and performance.
Career Highlights
Xiu has built a successful career at Intel Corporation, where he has been instrumental in developing cutting-edge technologies that enhance the reliability and efficiency of microelectronic devices. His work has significantly impacted the industry, leading to improved product performance and durability.
Collaborations
Throughout his career, Yonghao Xiu has collaborated with talented professionals, including Yiqun Bai and Nisha Ananthakrishnan. These collaborations have fostered innovation and contributed to the successful development of new technologies in the field.
Conclusion
Yonghao Xiu's contributions to microelectronic packaging through his patents and work at Intel Corporation highlight his role as a leading inventor in the industry. His innovative approaches continue to shape the future of technology.