The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Jun. 25, 2013
Intel Corporation, Santa Clara, CA (US);
Manish Dubey, Chandler, AZ (US);
Rajendra C. Dias, Phoenix, AZ (US);
Yonghao Xiu, Chandler, AZ (US);
Arjun Krishnan, Chandler, AZ (US);
Yiqun Bai, Chandler, AZ (US);
Purushotham Kaushik Muthur Srinath, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the present description include methods for attaching a microelectronic device to a microelectronic substrate with interconnection structures after disposing of an underfill material on the microelectronic device, wherein filler particles within the underfill material may be repelled away from the interconnection structures prior to connecting the microelectronic device to the microelectronic structure. These methods may include inducing a charge on the interconnection structures and may include placing the interconnection structures between opposing plates and producing a bias between the opposing plates after depositing the underfill material on the interconnection structures.