The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
May. 10, 2013
Yonghao Xiu, Chandler, AZ (US);
Yiqun Bai, Chandler, AZ (US);
Nisha Ananthakrishnan, Chandler, AZ (US);
Nachiket R. Raravikar, Gilbert, AZ (US);
Yonghao Xiu, Chandler, AZ (US);
Yiqun Bai, Chandler, AZ (US);
Nisha Ananthakrishnan, Chandler, AZ (US);
Nachiket R. Raravikar, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Epoxy-amine underfill materials for semiconductor packages and semiconductor packages having an epoxy-amine underfill material are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon. A semiconductor package substrate has a surface with a plurality of contact pads thereon. A plurality of conductive contacts couples the surface of the semiconductor die to the surface of the semiconductor package substrate. An epoxy-amine underfill material is disposed between the surface of the semiconductor die and the surface of the semiconductor package substrate and surrounds the plurality of conductive contacts. The epoxy-amine underfill has high adhesion and is based on a low volatility multi-functional amine species.