Saikumar Jayaraman

This inventor holds 73 USPTO granted patents and 22 published patent applications and 5 EPO patents, primarily in Microelectronic Packaging (CPC class H01L). Top assignees: Intel Corporation, The B. F. Goodrich Company, Promerus, Lcc. Active years: 1999-2025.

USPTO Granted Patents = 73 (Patent Applications = 22)

% Patents Active = 49.3

EPO Patents = 5 (Patent Applications = 4)

Average Co-Inventor Count = 3.1

ph-index = 16

Forward Citations = 794(Granted Patents)

Forward Citations (Not Self Cited) = 737(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Twinsburg, PA (US) (2002)
Cuyahoga Falls, OH (US) (1999 - 2004)
Twinsburg, OH (US) (2000 - 2004)
Chandler, AZ (US) (2003 - 2024)

Company Filing History:

The B. F. Goodrich Company

Sumitomo Bakelite Company Limited

patents

5. 1 out of 166,159

International Business Machines Corporation

patents

6. 7 out of 834,307

Other

patents

where one patent can have more than one assignee

Years Active: 1999-2025

Loading Chart...

Areas of Expertise:

Micro Socket Couplings

Device Authentication

Thermally-Optimized Tunable Stack

High Capacity Memory Packages

Polymer Matrices

Thermoset Polyimides

Thermal Interface Materials

Capillary-Flow Underfill

Photosensitive Compositions

Integrated Circuit Packaging

Silicone-Based Adhesives

73 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12341281 - Micro socket electrical couplings for dies (2025-06-24),

2. 12088695 - Systems and methods for device authentication in supply chain (2024-09-10),

3. 11769753 - Thermally-optimized tunable stack in cavity package-on-package (2023-09-26),

4. 11456281 - Architecture and processes to enable high capacity memory packages through memory die stacking (2022-09-27),

5. 10522450 - Pillar based socket (2019-12-31),

6. 10115606 - Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby (2018-10-30),

7. 9929080 - Forming a stress compensation layer and structures formed thereby (2018-03-27),

8. 9859253 - Integrated circuit package stack (2018-01-02),

9. 9728515 - Integrated WLUF and SOD process (2017-08-08),

10. 9659889 - Solder-on-die using water-soluble resist system and method (2017-05-23),

11. 9646903 - Thermoset polymides for microelectronic applications (2017-05-09),

12. 9472517 - Dry-removable protective coatings (2016-10-18),

13. 9349698 - Integrated WLUF and SOD process (2016-05-24),

14. 9330993 - Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby (2016-05-03),

15. 9247686 - Polymer matrices for polymer solder hybrid materials (2016-01-26),

Title: The Innovative Journey of Saikumar Jayaraman

Introduction: Saikumar Jayaraman, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology through his creative and groundbreaking inventions.

Latest Patents: Saikumar Jayaraman holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his expertise and forward-thinking approach to innovation.

Career Highlights: With a background in computer science and engineering, Saikumar Jayaraman has a successful career marked by his ability to translate complex technological concepts into practical and impactful inventions. His dedication to pushing the boundaries of innovation has led to the development of cutting-edge solutions that have the potential to shape the future.

Collaborations: Throughout his career, Saikumar Jayaraman has collaborated with leading tech companies and research institutions to further his inventions and bring them to market. His collaborative spirit and passion for innovation have been instrumental in the success of his projects.

Conclusion: Saikumar Jayaraman's relentless pursuit of innovation and his commitment to creating technology that makes a difference have established him as a respected figure in the world of inventors. His work continues to inspire and drive progress in the ever-evolving tech industry.