The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Dec. 20, 2013
Intel Corporation, Santa Clara, CA (US);
Mihir Oka, Chandler, AZ (US);
Xavier Brun, Chandler, AZ (US);
Dingying David Xu, Chandler, AZ (US);
Edward Prack, Phoenix, AZ (US);
Kabirkumar Mirpuri, Scottsdale, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.