The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Jul. 31, 2018
Intel Corporation, Santa Clara, CA (US);
George Vakanas, Tempe, AZ (US);
Aastha Uppal, Chandler, AZ (US);
Shereen Elhalawaty, Scottsdale, AZ (US);
Aaron McCann, Queen Creek, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Tannaz Harirchian, Scottsdale, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include an electronics package and methods of forming such electronics packages. In an embodiment, the electronics package comprises a package substrate, and a first die coupled to the package substrate. In an embodiment, a cavity is formed through the package substrate. In an embodiment, the cavity is within a footprint of the first die. In an embodiment, the electronics package further comprises a thermal stack in the cavity. In an embodiment, the thermal stack contacts the first die.