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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Tannaz Harirchian

This inventor holds 6 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tannaz Harirchian. Retrieved from https://idiyas.com/inventor/tannaz-harirchian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 83.3

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 109(Granted Patents)


Location History:

  • Chandler, AZ (US) (2014 - 2022)
  • Scottsdale, AZ (US) (2023)

Company Filing History:

goldMedal6 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2014-2023

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6 patents (USPTO):Explore Patents
1. 11769753 - Thermally-optimized tunable stack in cavity package-on-package (2023-09-26),
2. 11469185 - Standoff members for semiconductor package (2022-10-11),
3. 10424559 - Thermal management of molded packages (2019-09-24),
4. 9520376 - Bumpless build-up layer package including an integrated heat spreader (2016-12-13),
5. 9153552 - Bumpless build-up layer package including an integrated heat spreader (2015-10-06),
6. 8912670 - Bumpless build-up layer package including an integrated heat spreader (2014-12-16),

I specialize in innovations, inventions, inventors, patent attorneys, assignees, and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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