This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Shereen Elhalawaty: Innovator in Electronics Packaging
Introduction
Shereen Elhalawaty is a prominent inventor based in Scottsdale, AZ (US). She has made significant contributions to the field of electronics packaging, particularly through her innovative designs and methods. Her work focuses on enhancing the performance and efficiency of electronic devices.
Latest Patents
Shereen holds a patent for a "Thermally-optimized tunable stack in cavity package-on-package." This invention includes an electronics package and methods for forming such packages. The design features a package substrate with a first die coupled to it, and a cavity formed through the substrate. The thermal stack within the cavity is designed to contact the first die, optimizing thermal management in electronic applications.
Career Highlights
Shereen has established herself as a key player in her field, working at Intel Corporation. Her expertise in electronics packaging has led to advancements that benefit various electronic devices. With her innovative approach, she continues to push the boundaries of technology.
Collaborations
Shereen collaborates with talented individuals such as George Vakanas and Aastha Uppal. Together, they work on projects that aim to improve electronic packaging solutions and drive innovation in the industry.
Conclusion
Shereen Elhalawaty is a trailblazer in the realm of electronics packaging, with her patent showcasing her commitment to innovation. Her contributions are paving the way for future advancements in technology.