Intel Corporation

Shereen Elhalawaty

Saikumar Jayaraman

Edvin Cetegen

Aastha Uppal

George Vakanas

Aaron McCann

Tannaz Harirchian

Embodiments disclosed herein include an electronics package and methods of forming such electronics packages. In an embodiment, the electronics package comprises a package substrate, and a first die coupled to the package substrate. In an embodiment, a cavity is formed through the package substrate. In an embodiment, the cavity is within a footprint of the first die. In an embodiment, the electronics package further comprises a thermal stack in the cavity. In an embodiment, the thermal stack contacts the first die.

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Scottsdale, AZ, United States of America

Shereen Elhalawaty