The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Sep. 29, 2018
Intel Corporation, Santa Clara, CA (US);
Yí Li, Chandler, AZ (US);
Zhiguo Qian, Chandler, AZ (US);
Prasad Ramanathan, Chandler, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Hector Amador, Chandler, AZ (US);
Andrew Collins, Chandler, AZ (US);
Jianyong Xie, Chandler, AZ (US);
Shigeki Tomishima, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments include electronic packages and methods of forming such packages. An electronic package includes a memory module comprising a first memory die. The first memory die includes first interconnects with a first pad pitch and second interconnects with a second pad pitch, where the second pad pitch is less than the first pad pitch. The memory module also includes a redistribution layer below the first memory die, and a second memory die below the redistribution layer, where the second memory die has first interconnects with a first pad pitch and second interconnects with a second pad pitch. The memory module further includes a mold encapsulating the second memory die, where through mold interconnects (TMIs) provide an electrical connection from the redistribution layer to mold layer. The TMIs may be through mold vias. The TMIs may be made through a passive interposer that is encapsulated in the mold.