Andrew Paul Collins

This inventor holds 36 USPTO granted patents and 25 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Other. Active years: 1980-2026.

USPTO Granted Patents = 36 (Patent Applications = 25)

% Patents Active = 97.2

EPO Patents = 2 (Patent Applications = 5)

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 102(Granted Patents)

Location History:

Durham, NC (US) (1980 - 1981)
Hillsboro, OR (US) (2014 - 2018)
Chandler, AZ (US) (2019 - 2024)

Company Filing History:

31 out of 56,240

Intel Corporation

patents

5 out of 834,411

Other

patents

Years Active: 1980-2026

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Areas of Expertise:

Semiconductor Packages

Chiplets

Memory Integration

Low-Inductance

Interconnect Bridges

Embedded Memory

Die Stacking

Power Distribution

Decoupling Arrangement

Flexible Die

High Bandwidth

Recreational Basketball

36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12702036 - Ultra low loss routing between glass cores (2026-08-04),

2. 12690136 - Embedded passives with cavity sidewall interconnect in glass core architecture (2026-07-21),

3. 12642120 - Ultra low loss and high-density routing between cores (2026-05-26),

4. 12512396 - Flexible die to floor planning with bump pitch scale through glass core via pitch (2025-12-30),

5. 12436912 - Disaggregated die with input/output (I/O) tiles (2025-10-07),

6. 12388019 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2025-08-12),

7. 12347780 - Integrated circuit package with flipped high bandwidth memory device (2025-07-01),

8. 12205924 - Semiconductor packages with chiplets coupled to a memory device (2025-01-21),

9. 12051647 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2024-07-30),

10. 12046568 - Capacitor die embedded in package substrate for providing capacitance to surface mounted die (2024-07-23),

11. 11728294 - Capacitor die embedded in package substrate for providing capacitance to surface mounted die (2023-08-15),

12. 11705398 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2023-07-18),

13. 11705390 - Variable in-plane signal to ground reference configurations (2023-07-18),

14. 11621223 - Interconnect hub for dies (2023-04-04),

15. 11610862 - Semiconductor packages with chiplets coupled to a memory device (2023-03-21),

Title: Andrew Paul Collins - Innovative Inventor from Chandler, AZ

Introduction: Andrew Paul Collins is a renowned inventor based in Chandler, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Andrew Paul Collins holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Andrew Paul Collins has consistently pushed the boundaries of innovation, leading to the development of cutting-edge solutions that have revolutionized the way we live and work.

Collaborations: Throughout his career, Andrew Paul Collins has collaborated with leading companies, research institutions, and universities to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Andrew Paul Collins continues to inspire the next generation of inventors with his creative vision and passion for innovation, leaving a lasting impact on the world of technology and beyond.