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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Andrew Paul Collins

USPTO Granted Patents = 32 

 

Average Co-Inventor Count = 2.3

ph-index = 6

Forward Citations = 86(Granted Patents)


Location History:

  • Durham, NC (US) (1980 - 1981)
  • Hillsboro, OR (US) (2014 - 2018)
  • Chandler, AZ (US) (2019 - 2024)

Company Filing History:

goldMedal27 out of 54,750 
 
Intel Corporation
 patents
silverMedal5 out of 832,843 
Other
 patents

Years Active: 1980-2025

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32 patents (USPTO):Explore Patents
1. 12436912 - Disaggregated die with input/output (I/O) tiles (2025-10-07),
2. 12388019 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2025-08-12),
3. 12347780 - Integrated circuit package with flipped high bandwidth memory device (2025-07-01),
4. 12205924 - Semiconductor packages with chiplets coupled to a memory device (2025-01-21),
5. 12051647 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2024-07-30),
6. 12046568 - Capacitor die embedded in package substrate for providing capacitance to surface mounted die (2024-07-23),
7. 11728294 - Capacitor die embedded in package substrate for providing capacitance to surface mounted die (2023-08-15),
8. 11705398 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2023-07-18),
9. 11705390 - Variable in-plane signal to ground reference configurations (2023-07-18),
10. 11621223 - Interconnect hub for dies (2023-04-04),
11. 11610862 - Semiconductor packages with chiplets coupled to a memory device (2023-03-21),
12. 11569173 - Bridge hub tiling architecture (2023-01-31),
13. 11562993 - Embedded memory device and method for embedding memory device in a substrate (2023-01-24),
14. 11462521 - Multilevel die complex with integrated discrete passive components (2022-10-04),
15. 11456281 - Architecture and processes to enable high capacity memory packages through memory die stacking (2022-09-27),

Title: Andrew Paul Collins - Innovative Inventor from Chandler, AZ

Introduction: Andrew Paul Collins is a renowned inventor based in Chandler, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Andrew Paul Collins holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Andrew Paul Collins has consistently pushed the boundaries of innovation, leading to the development of cutting-edge solutions that have revolutionized the way we live and work.

Collaborations: Throughout his career, Andrew Paul Collins has collaborated with leading companies, research institutions, and universities to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Andrew Paul Collins continues to inspire the next generation of inventors with his creative vision and passion for innovation, leaving a lasting impact on the world of technology and beyond.

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