The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Dec. 24, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Arghya Sain, Chandler, AZ (US);

Andrew P. Collins, Chandler, AZ (US);

Sivaseetharaman Pandi, Chandler, AZ (US);

Jianyong Xie, Chandler, AZ (US);

Telesphor Kamgaing, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 70/685 (2026.01); H10W 70/692 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/692 (2026.01); H10W 70/095 (2026.01); H10W 70/635 (2026.01); H10W 70/685 (2026.01); H10W 90/724 (2026.01);
Abstract

Embodiments disclosed herein include a package core. In an embodiment, the package core includes a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises glass. In an embodiment, a third layer is over the second layer, where the third layer comprises glass. In an embodiment, a first trace is between the first layer and the second layer. In an embodiment, a second trace is between the second layer and the third layer.


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