The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 24, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jianyong Xie, Chandler, AZ (US);
Andrew P. Collins, Chandler, AZ (US);
Arghya Sain, Chandler, AZ (US);
Sivaseetharaman Pandi, Chandler, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 44/00 (2026.01); H01F 17/00 (2006.01); H01F 27/28 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H10D 1/20 (2025.01); H10W 20/40 (2026.01); H10W 70/63 (2026.01); H10W 70/692 (2026.01);
U.S. Cl.
CPC ...
H10W 44/501 (2026.01); H01F 27/2804 (2013.01); H05K 1/0306 (2013.01); H05K 1/165 (2013.01); H10D 1/20 (2025.01); H10W 20/497 (2026.01); H10W 70/635 (2026.01); H10W 70/692 (2026.01); H01F 2017/0066 (2013.01); H01F 2017/008 (2013.01); H05K 1/0221 (2013.01);
Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.