Hector Amador

Title: Hector Amador: Innovator in High Capacity Memory Packaging

Introduction

Hector Amador is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging, particularly in high capacity memory solutions. His innovative work has led to the development of a patent that enhances memory die stacking processes.

Latest Patents

Hector Amador holds a patent titled "Architecture and processes to enable high capacity memory packages through memory die stacking." This patent includes embodiments of electronic packages and methods for forming such packages. The electronic package features a memory module that comprises a first memory die with interconnects of varying pad pitches. Additionally, it includes a redistribution layer and a second memory die, all encapsulated in a mold that provides electrical connections through mold interconnects.

Career Highlights

Hector Amador is currently employed at Intel Corporation, where he continues to push the boundaries of memory technology. His work focuses on improving the efficiency and capacity of memory modules, which are crucial for modern electronic devices.

Collaborations

Throughout his career, Hector has collaborated with notable colleagues, including Yí Li and Zhiguo Qian. These partnerships have fostered innovation and have contributed to the advancement of technology in the field of electronic packaging.

Conclusion

Hector Amador's contributions to high capacity memory packaging exemplify the spirit of innovation in the technology sector. His patent and ongoing work at Intel Corporation highlight his commitment to advancing electronic solutions.