Yí Li

Title: Yí Li: Innovator in High Capacity Memory Packaging

Introduction

Yí Li is a prominent inventor based in Chandler, AZ, known for his contributions to the field of electronic packaging. With a focus on enhancing memory technology, he has developed innovative solutions that address the growing demands for high capacity memory packages.

Latest Patents

Yí Li holds a patent titled "Architecture and processes to enable high capacity memory packages through memory die stacking." This invention encompasses electronic packages and methods for forming such packages. The electronic package includes a memory module featuring a first memory die with interconnects of varying pad pitches. Additionally, the design incorporates a redistribution layer and a second memory die, enhancing the overall efficiency and capacity of memory modules.

Career Highlights

Yí Li is currently employed at Intel Corporation, where he applies his expertise in memory technology. His work has significantly contributed to advancements in electronic packaging, making him a valuable asset to the company and the industry.

Collaborations

Yí Li collaborates with notable colleagues, including Zhiguo Qian and Prasad Ramanathan, who share his commitment to innovation in electronic packaging.

Conclusion

Yí Li's work in high capacity memory packaging exemplifies the intersection of innovation and technology. His contributions continue to shape the future of electronic memory solutions.