Intel Corporation

Yí Li

Kemal Aygun

Zhiguo Qian

Saikumar Jayaraman

Shigeki Tomishima

Andrew Paul Collins

Jianyong Xie

Prasad Ramanathan

Hector Amador

Embodiments include electronic packages and methods of forming such packages. An electronic package includes a memory module comprising a first memory die. The first memory die includes first interconnects with a first pad pitch and second interconnects with a second pad pitch, where the second pad pitch is less than the first pad pitch. The memory module also includes a redistribution layer below the first memory die, and a second memory die below the redistribution layer, where the second memory die has first interconnects with a first pad pitch and second interconnects with a second pad pitch. The memory module further includes a mold encapsulating the second memory die, where through mold interconnects (TMIs) provide an electrical connection from the redistribution layer to mold layer. The TMIs may be through mold vias. The TMIs may be made through a passive interposer that is encapsulated in the mold.

Architecture and processes to enable high capacity memory packages through memory die stacking

Growing community of inventors

Chandler, AZ, United States of America

Yí Li