Mesa, AZ, United States of America

Beverly J Canham


Average Co-Inventor Count = 7.7

ph-index = 1

Forward Citations = 15(Granted Patents)


Location History:

  • Chandler, AZ (US) (2005)
  • Mesa, AZ (US) (2016 - 2018)

Company Filing History:


Years Active: 2005-2018

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3 patents (USPTO):

Title: Innovations by Beverly J Canham

Introduction

Beverly J Canham is a notable inventor based in Mesa, AZ, who has made significant contributions to the field of microelectronics. With a total of three patents to her name, she has focused on enhancing the performance and reliability of microelectronic packaging structures.

Latest Patents

Her latest patents include methods of promoting adhesion between underfill and conductive bumps, as well as methods of forming a microelectronic packaging structure. These innovations involve modifying underfill materials with various adhesion promoters and cross-linking polymer chemistries. Such advancements greatly enhance adhesion in package structures, ensuring better performance and durability.

Career Highlights

Beverly J Canham has established herself as a key figure in her field, working at Intel Corporation. Her expertise in microelectronic packaging has led to significant advancements that benefit the industry.

Collaborations

Throughout her career, Beverly has collaborated with talented individuals such as Yiqun Bai and Yuying Wei. These partnerships have contributed to her innovative work and the successful development of her patents.

Conclusion

Beverly J Canham's contributions to microelectronics through her patents and collaborations highlight her role as a leading inventor in the industry. Her work continues to influence advancements in microelectronic packaging technologies.

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