The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Dec. 30, 2003
Ashay A. Dani, Chandler, AZ (US);
Gudbjorg H. Oskarsdottir, Chandler, AZ (US);
Chris Matayabas, Jr., Chandler, AZ (US);
Sujit Sharan, Chandler, AZ (US);
Chris L. Rumer, Chandler, AZ (US);
Beverly J. Canham, Chandler, AZ (US);
Ashay A. Dani, Chandler, AZ (US);
Gudbjorg H. Oskarsdottir, Chandler, AZ (US);
Chris Matayabas, Jr., Chandler, AZ (US);
Sujit Sharan, Chandler, AZ (US);
Chris L. Rumer, Chandler, AZ (US);
Beverly J. Canham, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.