Intel Corporation

Beverly J Canham

Saikumar Jayaraman

Nisha Ananthakrishnan

Yiqun Bai

Arjun Krishnan

Suriyakala Ramalingam

Yonghao Xiu

Sivakumar Nagarajan

Yuying Wei

Sujit Sharan

Ashay A Dani

Gudbjorg H Oskarsdottir

Chris Matayabas

Chris Rumer

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.

Silicon wafer with soluble protective coating

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Mesa, AZ, United States of America

Beverly J Canham