The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Sep. 30, 2011
Applicants:

Sivakumar Nagarajan, Chandler, AZ (US);

Sandeep Razdan, Chandler, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Craig J. Weinman, Mesa, AZ (US);

Kabirkumar J. Mirpuri, Scottsdale, AZ (US);

Inventors:

Sivakumar Nagarajan, Chandler, AZ (US);

Sandeep Razdan, Chandler, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Craig J. Weinman, Mesa, AZ (US);

Kabirkumar J. Mirpuri, Scottsdale, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); C08G 59/42 (2006.01); C09J 5/06 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3489 (2013.01); C08G 59/42 (2013.01); C08L 63/00 (2013.01); C09J 5/06 (2013.01); H01L 21/56 (2013.01); H01L 24/29 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92143 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01327 (2013.01); H05K 3/3436 (2013.01); H05K 3/3494 (2013.01); Y10T 29/49144 (2015.01); Y10T 29/49146 (2015.01);
Abstract

A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.


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