Mesa, AZ, United States of America

Craig Jonathan Weinman

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2011-2019

where 'Filed Patents' based on already Granted Patents

3 patents (USPTO):

Title: The Innovative Contributions of Craig Jonathan Weinman

Introduction

Craig Jonathan Weinman is a notable inventor based in Mesa, Arizona, with a focus on advancements in microelectronics. He holds three patents that showcase his expertise in developing materials and processes that enhance electronic packaging.

Latest Patents

Weinman's latest patents include a two-material high K thermal encapsulant system. This invention relates to an electronic package that features a first die and a second die stacked onto the first die. A first encapsulant is positioned between the two dies, consisting of a material that covers a specific volume. A second encapsulant is also present, which promotes electrical connections more effectively than the first material. His second patent involves a fluxing-encapsulant material for microelectronic packages, specifically designed for use in a thermal compression bonding process. This process includes precise temperature control and the use of epoxy resins combined with a curing agent and a fluxing agent.

Career Highlights

Throughout his career, Weinman has worked with prominent organizations such as Intel Corporation and Cornell University. His experience in these institutions has contributed significantly to his innovative work in the field of microelectronics.

Collaborations

Weinman has collaborated with talented individuals, including Sivakumar Nagarajan and Nisha Ananthakrishnan, who have contributed to his projects and research endeavors.

Conclusion

Craig Jonathan Weinman is a distinguished inventor whose contributions to microelectronics have made a significant impact. His innovative patents and collaborations reflect his commitment to advancing technology in this field.

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