Intel Corporation

Cornell University

Kraton Polymers LLC

Craig Jonathan Weinman

Nisha Ananthakrishnan

Sivakumar Nagarajan

Carl Lesley Willis

Christopher Kemper Ober

Sandeep Razdan

Amram Eitan

Elah Bozorg-Grayeli

Liwei Wang

Kabirkumar Mirpuri

Venmathy McMahan

Daewon Park

Amrita Mallik

Kuang-Han Chu

Dale L Handlin

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Two material high K thermal encapsulant system

A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250&#xb0; C.-300&#xb0; C. at a ramp rate of 50&#xb0; C./second-100&#xb0; C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.

Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process

The invention provides novel polymers, including triblock polymers, as well as methods of preparing the polymers, and compositions that include such polymers. The polymers can include at least three blocks, the first block that includes poly(styrene), the second block that includes a random arrangement of poly(ethylene) and poly(butylene), and a third block that includes functionalized poly(isoprene). Units of the functionalized poly(isoprene) block can include hydroxyl groups and one or more ether linked side chains comprising R, R, R, R, R, R, as defined herein, or a combination thereof. The polymers can be used to provide antifouling coatings, for example, for marine ship hulls.

Triblock polymers and polymer coatings

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Mesa, AZ, United States of America

Craig Jonathan Weinman