The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Apr. 29, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Sivakumar Nagarajan, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); C09J 163/00 (2006.01); C09J 187/00 (2006.01); C09J 153/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C09J 153/00 (2013.01); C09J 163/00 (2013.01); C09J 187/005 (2013.01); H01L 21/563 (2013.01); H01L 23/3142 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0665 (2013.01);
Abstract
Embodiments of the present disclosure are directed toward underfill material including block copolymer. In one embodiment, an underfill material includes epoxy material and a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.