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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Liwei Wang

This inventor holds 6 USPTO granted patents and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2018-2023.

USPTO Granted Patents = 6

% Patents Active = 66.7

 

Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal6 out of 56,184 
 
Intel Corporation
 patents

Years Active: 2018-2023

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6 patents (USPTO):Explore Patents
1. 11804470 - Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control (2023-10-31),
2. 11670561 - 3D buildup of thermally conductive layers to resolve die height differences (2023-06-06),
3. 11022792 - Coupling a magnet with a MEMS device (2021-06-01),
4. 10475715 - Two material high K thermal encapsulant system (2019-11-12),
5. 10315200 - Apparatus and system for storing and transporting magnetic devices (2019-06-11),
6. 10125013 - Microelectromechanical system with spring for magnet placement (2018-11-13),

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