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Phoenix, AZ, United States of America

Liwei Wang

USPTO Granted Patents = 6

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 1(Granted Patents)

Company Filing History:

6 out of 54,664

Intel Corporation

Years Active: 2018-2023

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11804470 - Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control (2023-10-31),

2. 11670561 - 3D buildup of thermally conductive layers to resolve die height differences (2023-06-06),

3. 11022792 - Coupling a magnet with a MEMS device (2021-06-01),

4. 10475715 - Two material high K thermal encapsulant system (2019-11-12),

5. 10315200 - Apparatus and system for storing and transporting magnetic devices (2019-06-11),

6. 10125013 - Microelectromechanical system with spring for magnet placement (2018-11-13),

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