The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Dec. 27, 2016
Intel Corporation, Santa Clara, CA (US);
Kyle Yazzie, San Tan Valley, AZ (US);
Anna M. Prakash, Chandler, AZ (US);
Suriyakala Ramalingam, Chandler, AZ (US);
Liwei Wang, Phoenix, AZ (US);
Robert Starkston, Phoenix, AZ (US);
Arnab Choudhury, Santa Clara, CA (US);
Sandeep S. Iyer, Chandler, AZ (US);
Amanuel M. Abebaw, Chandler, AZ (US);
Nick Labanok, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.