Company Filing History:
Years Active: 2019
Title: Amrita Mallik: Innovator in Electronic Packaging and Bonding Technologies
Introduction
Amrita Mallik is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of electronic packaging and bonding technologies. With a total of 2 patents, her work has garnered attention for its innovative approaches and practical applications.
Latest Patents
Amrita's latest patents include a two-material high K thermal encapsulant system. This invention relates to an electronic package that features a first die and a second die stacked onto the first die. A first encapsulant is positioned between the two dies, consisting of a first material that covers a specific volume. A second encapsulant is also present, which includes a second material that covers another volume. The first material is designed to have higher thermal conductivity, while the second material promotes electrical connections more effectively.
Another notable patent is focused on thermocompression bonding using plasma gas. This invention describes devices and techniques for thermocompression bonding, including a housing that defines a chamber and a platform located within it. A plasma jet is positioned near the platform and is capable of directing plasma gas onto the platform, enhancing the bonding process.
Career Highlights
Amrita Mallik is currently employed at Intel Corporation, where she applies her expertise in electronic packaging and bonding technologies. Her innovative work has contributed to advancements in the industry, making her a valuable asset to her team.
Collaborations
Amrita has collaborated with notable coworkers, including Donglai David Lu and Jimin Yao. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Amrita Mallik's contributions to electronic packaging and bonding technologies highlight her role as a leading inventor in her field. Her patents reflect her commitment to innovation and her ability to address complex challenges in technology.