Intel Corporation

Amrita Mallik

Shawna M Liff

Nisha Ananthakrishnan

Jimin Yao

Amram Eitan

Elah Bozorg-Grayeli

George S Kostiew

Sivakumar Nagarajan

Liwei Wang

Craig Jonathan Weinman

Venmathy McMahan

Donglai David Lu

Kuang-Han Chu

Craig J Weinman

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Two material high K thermal encapsulant system

Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

Thermocompression bonding using plasma gas

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Chandler, AZ, United States of America

Amrita Mallik