The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Mar. 30, 2018
Intel Corporation, Santa Clara, CA (US);
Ziyin Lin, Chandler, AZ (US);
Vipul Mehta, Chandler, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Yuying Wei, Chandler, AZ (US);
Sushrutha Gujjula, Chandler, AZ (US);
Nisha Ananthakrishnan, Chandler, AZ (US);
Shan Zhong, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.