IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Shan Zhong

USPTO Granted Patents = 11 

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 56(Granted Patents)


Company Filing History:

goldMedal11 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2015-2024

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11 patents (USPTO):
1. 12002727 - Barrier structures for underfill containment (2024-06-04),
2. 11776821 - Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap (2023-10-03),
3. 11282717 - Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap (2022-03-22),
4. 11156815 - Compound parabolic concentrator including protrusion (2021-10-26),
5. 10636769 - Semiconductor package having spacer layer (2020-04-28),
6. 10128225 - Interconnect structures with polymer core (2018-11-13),
7. 10083936 - Semiconductor package having spacer layer (2018-09-25),
8. 9613934 - Interconnect structures with polymer core (2017-04-04),
9. 9490196 - Multi die package having a die and a spacer layer in a recess (2016-11-08),
10. 9299660 - Controlled solder-on-die integrations on packages and methods of assembling same (2016-03-29),
11. 8987918 - Interconnect structures with polymer core (2015-03-24),

Title: The Innovative Contributions of Shan Zhong

Introduction

Shan Zhong is a prominent inventor based in Chandler, AZ, known for his significant contributions to the field of microelectronics. With a total of 11 patents to his name, he has made remarkable advancements in integrated circuit assembly and packaging technologies. His work has been instrumental in enhancing the efficiency and reliability of electronic devices.

Latest Patents

One of Shan Zhong's latest patents is titled "Barrier structures for underfill containment." This invention involves an integrated circuit assembly that includes an electronic substrate and two integrated circuit devices. The design features a barrier structure that ensures the underfill material is effectively contained, improving the overall performance of the assembly. Another notable patent is "Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap." This innovation introduces a substrate protrusion that aids in the dispensing of underfill material, optimizing the manufacturing process for micro-electronic packages.

Career Highlights

Shan Zhong has built a successful career at Intel Corporation, where he has been able to apply his expertise in microelectronics. His innovative designs and patents have contributed to the advancement of the company's product offerings, making them more competitive in the market. His work is characterized by a commitment to improving electronic assembly processes and enhancing device performance.

Collaborations

Throughout his career, Shan Zhong has collaborated with talented individuals such as Weng Hong Teh and Sandeep Razdan. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the field of microelectronics.

Conclusion

Shan Zhong's contributions to the field of microelectronics through his patents and innovations have significantly impacted the industry. His work at Intel Corporation and collaborations with fellow inventors highlight his dedication to advancing technology. His inventions continue to pave the way for future developments in electronic assembly and packaging.

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