The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Feb. 13, 2015
Intel Corporation, Santa Clara, CA (US);
Sandeep Razdan, Chandler, AZ (US);
Edward R. Prack, Phoenix, AZ (US);
Sairam Agraharam, Chandler, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Shan Zhong, Chandler, AZ (US);
Robert M. Nickerson, Chandler, AZ (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.