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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Robert M Nickerson

USPTO Granted Patents = 42 

Average Co-Inventor Count = 3.9

ph-index = 9

Forward Citations = 324(Granted Patents)


Company Filing History:

goldMedal42 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2004-2025

where 'Filed Patents' based on already Granted Patents

42 patents (USPTO):
1. 12476174 - Ultra-thin, hyper-density semiconductor packages (2025-11-18),
2. 12417958 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone (2025-09-16),
3. 12406914 - Ultra-thin, hyper-density semiconductor packages (2025-09-02),
4. 12406906 - Through mold interconnect drill feature (2025-09-02),
5. 12394773 - Laser ablation-based surface property modification and contamination removal (2025-08-19),
6. 12362340 - Laser ablation-based surface property modification and contamination removal (2025-07-15),
7. 12347743 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone (2025-07-01),
8. 12315777 - Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone (2025-05-27),
9. 12107082 - Offset interposers for large-bottom packages and large-die package-on-package structures (2024-10-01),
10. 11978730 - Offset interposers for large-bottom packages and large-die package-on-package structures (2024-05-07),
11. 11798932 - Offset interposers for large-bottom packages and large-die package-on-package structures (2023-10-24),
12. 11705383 - Through mold interconnect drill feature (2023-07-18),
13. 11462527 - Micro-trenching mold interface in a pop package (2022-10-04),
14. 11430724 - Ultra-thin, hyper-density semiconductor packages (2022-08-30),
15. 11222877 - Thermally coupled package-on-package semiconductor packages (2022-01-11),

Title: Robert M. Nickerson: Innovator in Package Technologies

Introduction

Robert M. Nickerson is a prominent inventor based in Chandler, Arizona, recognized for his significant contributions to package technologies in the electronics sector. With an impressive portfolio of 34 patents, he has played a key role in developing innovative solutions that enhance the performance of electronic packages.

Latest Patents

Among his latest inventions are groundbreaking technologies like "Offset interposers for large-bottom packages and large-die package-on-package structures." This innovation features an offset interposer that includes a land side with a ball-grid array (BGA) and a package-on-package (POP) side, also configured with a POP-side BGA. The design incorporates adjacent, spaced-apart land-side pads and POP-side pads, facilitating connections through the offset interposer. Each land-side pad boasts a distinct footprint compared to the corresponding POP-side pads, optimizing interconnectivity with first-level and POP substrates.

Career Highlights

Robert has established himself as a crucial asset at Intel Corporation, where he continues to push the boundaries of electronic packaging innovation. His work is essential in developing advanced interconnect solutions, reflecting his expertise in both engineering and patent law.

Collaborations

Throughout his career, Robert has collaborated with talented colleagues such as Brian Taggart and Robert L. Sankman. Their collective efforts in the field of electronics packaging have led to numerous advancements that benefit the industry.

Conclusion

Robert M. Nickerson’s ongoing contributions to package technologies exemplify the spirit of innovation within the electronics industry. His patents and collaborative projects continue to inspire and shape the future of electronic design, making him a noteworthy figure in the realm of inventions and patent creation.

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