The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Sep. 24, 2010
Applicants:

Dingying Xu, Maricopa, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Hong Dong, Perry Hall, MD (US);

Rahul N. Manepalli, Chandler, AZ (US);

Nachiket Raravikar, Gilbert, AZ (US);

Gregory S. Constable, Chandler, AZ (US);

Inventors:

Dingying Xu, Maricopa, AZ (US);

Nisha Ananthakrishnan, Chandler, AZ (US);

Hong Dong, Perry Hall, MD (US);

Rahul N. Manepalli, Chandler, AZ (US);

Nachiket Raravikar, Gilbert, AZ (US);

Gregory S. Constable, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 41/49 (2006.01); C08L 83/00 (2006.01); C08G 77/00 (2006.01); C08L 63/00 (2006.01); C08G 65/48 (2006.01); C08L 23/08 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C08L 23/0884 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3512 (2013.01); C08G 59/3254 (2013.01); C08G 59/38 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.


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