The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Jun. 29, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Zhizhong Tang, Chandler, AZ (US);

Syadwad Jain, Chandler, AZ (US);

Wei Hu, Chandler, AZ (US);

Michael A. Schroeder, Chandler, AZ (US);

Rajen S. Sidhu, Portland, OR (US);

Carl L. Deppisch, Chandler, AZ (US);

Patrick Nardi, Scottsdale, AZ (US);

Kelly P. Lofgreen, Phoenix, AZ (US);

Manish Dubey, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); F28F 13/00 (2006.01); F28F 21/04 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 23/49811 (2013.01); H01L 24/00 (2013.01); F28D 2021/0029 (2013.01); F28F 13/003 (2013.01); F28F 21/02 (2013.01); F28F 21/04 (2013.01); F28F 21/08 (2013.01); F28F 2013/001 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01);
Abstract

Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.


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