Intel Corporation

Carl L Deppisch

Fay Hua

Thomas John Fitzgerald

Rajen S Sidhu

Sabina J Houle

Daewoong Suh

Mukul P Renavikar

Joni G Hansen

Ashay A Dani

Wei Hu

Abhishek Gupta

Tom Fitzgerald

Leonel R Arana

Edward Rudolph Prack

Sriram Srinivasan

Deepak Kulkarni

Anna M Prakash

Susheel G Jadhav

Lilia May

Thomas J De Bonis

Gregory S Constable

Martha A Dudek

Srinivasa R Aravamudhan

Youzhi E Xu

Jason Jieping Zhang

Manjit Dhindsa

Matthew J Schaenzer

Joan K Vrtis

James C Matayabas

Mark Norwil

Chang Lin

Gregory Martin Chrysler

Nachiket R Raravikar

Paul A Koning

Rajasekaran Swaminathan

Wei Shi

Pramod Malatkar

Christopher D Combs

Manish Dubey

Steven A Klein

Kelly P Lofgreen

Aravindha Antoniswamy

Syadwad Jain

Patrick Nardi

Edward L Martin

Tiffany Byrne

Michael Aaron Schroeder

Zhizhong Tang

Jinlin Wang

Peter D Brandenburger

John Harper

Jieping Zhang

Xiao Lu

Alexander W Huettis

Mohit Sood

Nikunj P Patel

Mike Boyd

Brad Drew

Chad A Kumaus

Mike Gasparek

Krista J Whittenburg

Kris J Whittenburg

Kim L Phillippe

Kristopher E Dayton

Jiongxin Lu

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Varied ball ball-grid-array (BGA) packages

Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Foam composite

An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

Package structure to enhance yield of TMI interconnections

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

Methods of fabricating low melting point solder reinforced sealant and structures formed thereby

A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.

Multi-component integrated heat spreader for multi-chip packages

Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

Multi-solder techniques and configurations for integrated circuit package assembly

A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.

Clad solder thermal interface material

In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed.

Forming a semiconductor package including a thermal interface material

A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation. The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

Composite solder TIM for electronic package

Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.

Methods of fabricating robust integrated heat spreader designs and structures formed thereby

Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed.

Coated thermal interface in integrated circuit die

Growing community of inventors

Chandler, AZ, United States of America

Carl L Deppisch