The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Dec. 21, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Mohit Mamodia, Chandler, AZ (US);
Kyle Yazzie, Chandler, AZ (US);
Dingying Xu, Chandler, AZ (US);
Kuang Liu, Queen Creek, AZ (US);
Paul J. Diglio, Chandler, AZ (US);
Pramod Malatkar, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H05B 3/26 (2006.01);
U.S. Cl.
CPC ...
H05B 3/267 (2013.01); G01R 31/2867 (2013.01); G01R 31/2875 (2013.01);
Abstract
A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.