This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Sanjoy Saha: Inventor in Electronic Packaging
Introduction
Sanjoy Saha is an inventor based in Portland, Oregon, and is associated with Intel Corporation. His patent work addresses electronic package design, with a focus on stiffener construction and attachment.
Latest Patents
Saha is named on 1 patent: “BGA Stiffener Attachment with Low Eolife Adhesive Strength at High Solder Joint Stress Area Generated from Enabling Load.” The patent describes an electronic package with a package substrate, a die coupled to the substrate, and a surrounding ring-shaped stiffener. The stiffener has corner regions and beams between them, with the beams thicker than the corner regions. This configuration addresses stiffener design in areas subject to high solder-joint stress.
Career Highlights
Saha’s listed patent reflects work on structural features for electronic packages. His association with Intel Corporation places this invention within the company’s semiconductor and packaging technology work.
Collaborations
The provided information lists Phil Geng and Ravindranath Vithal Mahajan as Saha’s coworkers. Their specific roles in the patent or related work are not stated.
Conclusion
Sanjoy Saha’s patent contribution focuses on a differentiated stiffener design for electronic packages, highlighting his work in semiconductor packaging innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile