Intel Corporation

Sanjoy Saha

Dingying David Xu

Patrick Nardi

Prasanna Raghavan

John Harper

Yang Jiao

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

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Portland, OR, United States of America

Sanjoy Saha