The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Mar. 30, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shelby A. Ferguson, Hillsboro, OR (US);

Bijoyraj Sahu, Portland, OR (US);

Russell Aoki, Tacoma, WA (US);

Thomas Boyd, Vancouver, WA (US);

Eric W. Buddrius, Hillsboro, OR (US);

Kevin Ceurter, Olympia, WA (US);

Mustafa Haswarey, Tigard, OR (US);

Rolf Laido, Sherwood, OR (US);

Daniel Neumann, Hillsboro, OR (US);

Rachel Taylor, DuPont, WA (US);

Anthony Valpiani, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/40 (2006.01); H01L 21/48 (2006.01); H01R 12/88 (2011.01); H01R 12/70 (2011.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 21/4882 (2013.01); H01L 23/4006 (2013.01); H01L 23/4093 (2013.01); H01R 12/7076 (2013.01); H01R 12/88 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10462 (2013.01); H05K 2201/10598 (2013.01); H05K 2201/10606 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/2018 (2013.01);
Abstract

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.


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