Daniel Neumann

Title: The Innovations of Daniel Neumann

Introduction

Daniel Neumann is an accomplished inventor based in Hillsboro, Oregon. He has made significant contributions to the field of technology, particularly in the area of socket retention mechanisms and load regulation for electronic packages. With a total of three patents to his name, Neumann's work has had a notable impact on the industry.

Latest Patents

Neumann's latest patents include innovative designs that enhance the functionality and reliability of electronic components. One of his patents focuses on Compression Mounted Technology (CMT) socket retention mechanisms. This invention includes sockets and electronic packages with unique socket architectures, featuring a housing with both a first and second surface, as well as interconnect pins and alignment holes. Another patent addresses socket load regulation utilizing CPU carriers with shim components. This assembly comprises a socket and a bolster plate, which includes load studs and an opening surrounding the socket. The design allows for effective coupling of electronic packages and heatsinks, ensuring optimal performance.

Career Highlights

Daniel Neumann is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key player in the advancement of electronic packaging solutions. Neumann's expertise and dedication to his craft have earned him recognition within the company and the industry at large.

Collaborations

Throughout his career, Neumann has collaborated with talented individuals such as Thomas A. Boyd and Eric W. Buddrius. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Daniel Neumann's contributions to the field of technology through his patents and work at Intel Corporation highlight his innovative spirit and commitment to excellence. His advancements in socket retention mechanisms and load regulation are paving the way for future developments in electronic packaging.