The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Mar. 30, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Andrew Larson, Hillsboro, OR (US);
Bijoyraj Sahu, Portland, OR (US);
Craig J. Jahne, Beaverton, OR (US);
Eric W. Buddrius, Hillsboro, OR (US);
Ralph V. Miele, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16B 33/00 (2006.01); F16B 37/00 (2006.01); H01L 23/40 (2006.01); F16B 37/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F16B 33/006 (2013.01); F16B 37/145 (2013.01); H01L 23/4093 (2013.01); H01L 2023/4087 (2013.01);
Abstract
A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.