The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Oct. 15, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Steven A. Klein, Chandler, AZ (US);

Kuang Liu, Queen Creek, AZ (US);

Thomas A. Boyd, Vancouver, WA (US);

Luis Gil Rangel, Hillsboro, OR (US);

Muffadal Mukadem, Portland, OR (US);

Shelby A. Ferguson, Winters, CA (US);

Francis Toth, Jr., Cornelius, OR (US);

Eric Buddrius, Hillsboro, OR (US);

Ralph V. Miele, Hillsboro, OR (US);

Sriram Srinivasan, Chandler, AZ (US);

Jeffory L. Smalley, East Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/485 (2006.01); H01L 23/32 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H01R 12/70 (2011.01); H05K 7/10 (2006.01); H01L 23/367 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H01L 23/32 (2013.01); H01L 23/3675 (2013.01); H01L 23/485 (2013.01); H01L 23/522 (2013.01); H01R 12/7076 (2013.01); H05K 3/301 (2013.01); H05K 3/368 (2013.01); H05K 7/10 (2013.01); H05K 2201/066 (2013.01);
Abstract

An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.


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