Fountain Hills, AZ, United States of America

Michael E Ryan

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)

Forward Citations (Not Self Cited) = 7(Sep 21, 2024)


Years Active: 2007-2025

where 'Filed Patents' based on already Granted Patents

4 patents (USPTO):

Title: Michael E. Ryan: Innovator in Microelectronics

Introduction

Michael E. Ryan, based in Fountain Hills, Arizona, is a notable inventor in the field of microelectronics. With a total of four patents to his name, Ryan has made significant contributions to the advancements in electrical and mechanical performance within microelectronic packaging.

Latest Patents

Among his latest innovations, Ryan has developed a patent titled "Heterogeneous socket contact for electrical and mechanical performance scaling in a microelectronic package." This invention introduces a microelectronic socket structure that comprises a housing defining a cavity and an interconnection structure, which includes a contact element configured to be electrically coupled to a microelectronic package. Notably, the contact element can be a signal contact or a ground contact, and it works in tandem with a conductive structure designed to enhance performance. Another significant patent from Ryan is related to "Reference layer openings," which describes a component with openings that help achieve differential impedance in circuits.

Career Highlights

Michael E. Ryan is currently associated with Intel Corporation, where he leverages his expertise to push the boundaries of microelectronic technologies. His work focuses on the development of innovative solutions that enhance the functionality and efficiency of electronic devices.

Collaborations

During his career, Ryan has had the opportunity to collaborate with talented coworkers such as Kok-Siang Ng and King Keong Wong. These collaborations contribute to a rich exchange of ideas and knowledge, helping to drive forward-thinking projects in microelectronics.

Conclusion

Michael E. Ryan stands out as a dedicated inventor and innovator. His work continues to influence the field of microelectronics significantly, making strides in how electronic packaging can be improved for better performance. With his ongoing contributions to Intel Corporation and the broader technological landscape, Ryan remains a key player in advancing microelectronic solutions.

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