Intel Corporation

Michael E Ryan

King Keong Wong

Kok-Siang Ng

Zhichao Zhang

Pooya Tadayon

Srikant Nekkanty

Steven A Klein

Feifei Cheng

Zhe Chen

A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package

A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.

Reference layer openings

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Fountain Hills, AZ, United States of America

Michael E Ryan