The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Mar. 26, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Wesley Morgan, Lake Oswego, OR (US);

Srikant Nekkanty, Chandler, AZ (US);

Todd R. Coons, Gilbert, AZ (US);

Gregorio R. Murtagian, Phoenix, AZ (US);

Xiaoqian Li, Chandler, AZ (US);

Nitin Deshpande, Chandler, AZ (US);

Divya Pratap, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4204 (2013.01); G02B 6/4261 (2013.01); G02B 6/4278 (2013.01); G02B 6/4292 (2013.01);
Abstract

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.


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